Enhancing Yield and Quality in Multilayer PCB Manufacturing Through DoE-Based Process Optimization

The escalating complexity of multilayer printed circuit boards (PCBs) for applications in automotive electronics, high-speed telecommunications, and industrial control systems demands rigorous process control to ensure high yield and long-term reliability. This study presents a systematic approach to optimizing critical fabrication processes in multilayer PCB manufacturing using Design of Experiments (DoE) methodology. A full-factorial experimental design was employed to investigate the effects of lamination temperature, pressure, and dwell time on delamination resistance and layer registration accuracy. Subsequently, Response Surface Methodology (RSM) with a Central Composite Design (CCD) was applied to optimize copper plating parameters current density, plating time, and bath temperature to achieve uniform thickness distribution while minimizing processing time. Analysis of Variance (ANOVA) revealed that lamination temperature and its interaction with pressure significantly influence bond integrity (p < 0.05), while current density emerged as the dominant factor affecting thickness variability. The optimized parameter settings reduced delamination defects by 67%, improved layer-to-layer registration from ±75 µm to ±35 µm, and decreased plating time by 28% while maintaining target thickness specifications. These findings demonstrate that DoE-driven process optimization provides a robust framework for enhancing manufacturing capability and product quality in high-reliability PCB applications.