Material-specific three-dimensional printing of electrostatic chuck components via digital light processing: Integration of Al2O3 and BaTiO3 as dual materials for performance optimization
Discuss this preprint
Start a discussion What are Sciety discussions?Listed in
This article is not in any list yet, why not save it to one of your lists.Abstract
Electrostatic chucks (ESCs) are critical components in semiconductor and display manufacturing, providing contact handling of delicate substrates. However, optimizing their performance requires precise control of material properties and structural design, particularly the dielectric layer and ESC body. In this study, we fabricated ESCs using a dual-material design, in which the dielectric layers were printed from BaTiO 3 -resin inks, while the bodies were printed using Al 2 O 3 -resin ink via digital light-processing (DLP) three-dimensional printing. The rheological properties of both Al 2 O 3 - and BaTiO 3 -resin inks were systematically characterized to determine their suitability for DLP printing, and the dielectric properties of the corresponding cured composites were evaluated to guide ESC performance optimization. ESC bodies and dielectric layers could be printed using Al 2 O 3 -resin ink reliably. The ESC body exhibited high breakdown strength, whereas the dielectric layers exhibited high dielectric constants. The fabricated ESCs exhibited excellent structural fidelity and enabled the reliable integration of internal electrodes via liquid-metal injection. Finite element analysis simulations indicated that the dielectric constant primarily governed the chucking force and was highly localized near the edges of the embedded electrodes. Experimental results confirmed that ESCs with BaTiO 3 -based dielectrics consistently outperformed those with Al 2 O 3 -based dielectrics. This finding is consistent with the simulation results. Overall, the combination of material selection, additive manufacturing, and electrostatic modeling provides a comprehensive and robust strategy for developing next-generation ESCs with tunable performance and complex geometries. These ESCs are suitable for advanced precision handling in the semiconductor and display industries.
