In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy

For reliable electronics, it is important to have an understanding of solder joint failure mechanisms. However, because of difficulties in real-time atomistic scale analysis during deformation, we still do not fully understand these mechanisms. Here, we report on the development of an innovative in situ method of observing the response of the microstructure to tensile strain at room temperature using high-voltage transmission electron microscopy (HV-TEM). This technique was used to observe events including dislocation formation and movement, grain boundary formation and separation, and crack initiation and propagation in a Sn-3 wt.%Ag-0.5 wt.%Cu (SAC305) alloy joint formed between copper substrates.