Effects of microstructure on reliability of BME-MLCCs

Five types of base metal multilayer ceramic dielectric capacitors (BME-MLCCs) with distinct microstructure were fabricated by adjusting the grinding intensity. The microstructural characteristics of the ceramics, including micro-morphology, grain size, and pore distribution, were analyzed using a scanning electron microscope (SEM). The impact of the microstructure of the ceramic thin films on the electrical properties and reliability of BME-MLCCs was discussed. The study found that when the grinding was insufficient or excessive, microscopic issues such as non-compactness, unevenness, and pores appeared in the dielectric layer, leading to capacity dispersion, a decline in insulation performance, and reduced reliability. It can thus be seen that grinding intensity serves as the foundation for preparing the dielectric layer, and a high-quality microscopic morphology of the dielectric layer is the key to achieving stable electrical properties and high reliability.