Emerging Paradigms in Thermal Interface Materials:Metallic Nanostructure–Based Hybrid Architecture Chakravardhan 22(CV22)**

The rapid escalation of power densities in modern electronic and power devices has intensified the demand for advanced thermal interface materials (TIMs) capable of delivering high thermal performance, mechanical compliance, and long-term reliability. Conventional polymer-based TIMs are increasingly constrained by intrinsic thermal limitations and degradation under service conditions. This work examines emerging paradigms in thermal interface engineering enabled by nanotechnology, with particular emphasis on metallic nanostructures and hybrid systems incorporating phase change materials (PCMs). A central focus is placed on the invention patent with brandname Chakravardahan 22 (CV22) architecture developed by Chakarvarti et al. 2024(1), which represents a transition from material-centric formulations to architecture-driven interface design.We discuss fundamentals, material strategies, fabrication considerations, performance metrics, and future research directions, positioning metallic nanostructure–PCM hybrid TIMs as a key enabler for next-generation and sustainable electronic systems.