Design and fabrication of a four-channel temperature and pressure sensor based on DCP and SIP technologies

This paper developed a four-channel temperature and pressure sensor based on dual chip package (DCP) and system in package (SIP) technologies, which could meet the synchronizing measurements of the temperature and pressure in aviation electromechanical systems. The pressure core of the sensor was designed and packaged by the dual chip packaging, achieving the miniaturization of the probe. The signal processing section of the sensor integrated the temperature circuit, pressure circuit, and electromagnetic protection circuit into several standard HTCC modules through SIP technology, breaking the design of the miniaturization of the circuit. Compared to the traditional temperature pressure sensor, the sensor in this paper reduced its maximum outer diameter by 27% and weight by 40% while getting the similar accuracy. The miniaturization and lightweight effects of the sensor were significant. In addition, the standardization and modularization design level of the sensor was improved by selecting corresponding SIP modules for combination.