Study on the coating performance of copper layer

A copper-coated iron composite exhibits both the mechanical properties of iron and the electrical conductivity of copper; however, its interfacial bonding strength and coating uniformity are significantly influenced by the preparation process. In this paper, the effects of the amount of additives in copper salt solution, the accumulation time of wet powder after coating, and the reduction temperature on the microstructure and properties of copper-iron composite powder were studied by the chemical replacement method. The microstructure and macroscopic morphology of the copper-iron composite powder were characterized using scanning electron microscopy (SEM) and a Digital Microscope. The crystal phase structure of copper-iron composite powder was detected by X-ray diffractometer (XRD). The results show that when the amount of additive in the copper salt solution is 1.0%, the copper coating layer on the surface is smooth and continuous. Deviation from this value will lead to overlap of the copper layer, rough surface, and an increase in oxygen content. When the wet powder accumulation time is more than 0 h, the copper layer on the surface is oxidized, and the CuO phase appears. The reduction temperature has a significant effect on the morphology and comprehensive properties of the copper layer. The optimum reduction temperature is 650°C. The copper layer on the surface of the obtained copper-iron composite powder is smooth, continuous, and dense. The oxygen content is 0.31%, the apparent density is 2.12 g / cm ³ , and the flow rate is 43.47 s / 50 g. This study provides a theoretical basis and process guidance for the development of high-density coated and low-oxygen copper-coated iron powder materials.