Influence of nanoclay concentration on the performance of the characteristics of particleboard made from rice husk bonded with urea-formaldehyde adhesive

This study examines the impact of nanoclay incorporation on the physical and mechanical properties of particleboard produced from rice husk. Three distinct concentrations of nanoclay, specifically 1%, 2%, and 3%, were incorporated based on the weight of urea-formaldehyde (UF) resin. For example, particleboard produced without the use of nanoclay served as a control. Furthermore, 1% ammonium chloride was included into the resin composition to expedite the adhesive curing process. The physical properties assessed included density, moisture content, thickness swelling, and water absorption, while the mechanical properties analysed comprised internal bonding (IB), modulus of rupture (MOR), and modulus of elasticity (MOE), all in line with the JIS A 5908:2003 standard. The findings demonstrated that mechanical characteristics enhanced with the incorporation of nanoclay by up to 3%.. Moreover, the incorporation of 2% nanoclay resulted in maximal enhancements in density and water absorption.