Green Chemistry: A Sustainable Alternative to Conventional Etching Solvents in Chemical Decapsulation

The shift toward sustainable practices is increasingly guided by green chemistry principles, focusing on reducing toxicity and environmental impact without compromising efficiency. This study investigates eco-friendly alternatives to hazardous chemicals used in the decapsulation of integrated circuits (ICs)—a critical step in failure analysis and cybersecurity. Traditional methods, often reliant on toxic acids like fuming nitric acid, pose significant environmental and health risks. The research evaluates renewable and safer materials, including rosin, Dynasolve 185, and Decap solvents, as substitutes. Through experimental applications on NAND chips, it examines their interactions with epoxy molding compounds and effects on IC integrity. Computational chemistry further supports the generation and optimization of some chemical structures. Findings indicate that rosin, a renewable resource, effectively decapsulates ICs at 120°C in 7 minutes, preserving chip functionality. Dynasolve 185 also proves effective, though requiring longer processing times, while Decap solvents provide precise etching with lower environmental risks. This study demonstrates the feasibility of green alternatives, promoting sustainability in electronic component processing. By reducing dependence on hazardous substances, these findings advance safer and eco-friendly manufacturing practices, aligning with global environmental goals.