Effects of In-situ Plasma Treatment on Water-vapor Permeation Barrier Properties Al2O3 Film Prepared by Plasma-enhanced Chemical Vapor Deposition

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Abstract

The effect of in-situ O 2 plasma treatment on the properties of D-CVD grown Al 2 O 3 layers was investigated. The Al 2 O 3 layers were prepared with a high deposition rate, and their surface roughness, density, stoichiometry, and water vapor permeation barrier properties were evaluated before and after the plasma treatment. The results showed that the O 2 plasma treatment significantly reduced the surface roughness and density of the Al 2 O 3 layer, while also curing the pores and defects present on its surface. The treatment led to the migration of Al and oxygen adatoms, resulting in a change in the atomic concentration ratio of Al to O and the formation of a strong bonding structure in the Al 2 O 3 layer. Furthermore, the water vapor transmission rate (WVTR) of the O 2 plasma treated Al 2 O 3 layer remained low and stable over a prolonged exposure time of 2,500 hours, demonstrating its enhanced water vapor barrier performance. In contrast, the WVTR of the non-treated Al 2 O 3 layer increased significantly after 100 hours of exposure. These findings highlight the effectiveness of in-situ O 2 plasma treatment in improving the surface properties and water vapor permeation barrier of D-CVD grown Al 2 O 3 layers, making them promising candidates for various applications requiring high barrier properties.

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