Experimental Investigation of Flash Spray Cooling for Power Electronics

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Abstract

Power electronics convert and control electrical power in applications ranging from electric motors to telecommunications and computing. Ongoing efforts to miniaturize these systems and boost power density demand advanced thermal management solutions to maintain optimal cooling and temperature control. Spray cooling offers an effective means of removing high heat fluxes and keeping power electronics within safe operating temperatures. This study presents an experimental investigation of flash spray cooling in a closed-loop system using R410A refrigerant. In particular, two nozzles with different spraying angles are used to study the effects of the distance between the spray nozzle and a heated flat surface, as well as the mass flow rate of the coolant. Results indicate that three key flow-pattern factors—surface coverage, impingement intensity, and liquid film dynamics—govern the heat-transfer mechanisms and determine cooling efficiency. Flash spray cooling using refrigerants like R410A demonstrates strong potential as a high-performance thermal management strategy for next-generation power electronics.

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