Frugal Design and AI-Driven Optimization for Open Material Research: a Multi-Extrusion Technology Platform for Direct Ink Writing

Direct Ink Writing (DIW) is an additive manufacturing technology that fabricates structures through layer-wise deposition of liquid materials. In this process, a liquid feedstock is dispensed onto a substrate via pneumatic or mechanical extrusion, followed by a solidification step, such as UV curing, for materials compatible with this approach.The growing demand for multi-material objects in fields like electronics and life sciences highlights DIW's potential to address these needs through its adaptability and precision. This study presents the development of a versatile multi-extrusion technology DIW platform designed with adaptability and reconfigurability at its core, ensuring compatibility with diverse material-specific processing requirements. Adopting a material-driven approach, the platform leverages principles of frugal innovation, incorporating in-house designed and 3D printed structural components to maximize accessibility and efficiency, as well as the use of artificial intelligence for the optimization of specific functionalities.Potential applications for this platform include 3D bioprinting, advanced electronics, and contributions to the circular economy, demonstrating its wide-ranging utility.