Effect of Modified Aluminum Oxide on Thermal Conductivity of Epoxy Resin

With the rapid development of modern electronic technology, electronic equipment tends to be dense and miniaturized, which puts forward higher thermal management requirements for epoxy resins (EP). In this paper, Al2O3 with different morphologies and different contents was used as the fillers, silane coupling agent γ-glycidyl ether oxypropyl trimethoxy-silane (KH560) was selected as the modifier to modify their surface, and the modified Al2O3/EP resin composites system were finally prepared. The effects of Al2O3 addition amount on thermal conductivity and dielectric constant of Al2O3/EP composites were investigated. The results show that the smaller size of Al2O3 has a positive effect on the thermal conductivity and dielectric properties of EP, while the modified Al2O3 can be uniformly dispersed in the EP matrix, forming a thermal conductivity network, the thermal conductivity of modified Al2O3/EP composite is significantly increased. The good thermal conductivity can meet the requirements of the field of microelectronics components for thermal conductivity.