An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings

  1. Ning An
  2. Bofeng Li
  3. Yuexing Wang
  4. Xiangyu Sun
  5. Xu He
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  1. Version published to 10.1007/s10854-026-16591-8
  2. Version published to 10.21203/rs.3.rs-8219436/v1 on Research Square