Improving the thermo-mechanical reliability of solderable isotropic conductive adhesive joints by using low- and high-melting-point solder fillers

  1. Yi Hyeon Baek
  2. Myeong Jin Jung
  3. Jeong Il Lee
  4. Jong-Min Kim
  5. Byung-Seung Yim
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  1. Version published to 10.1007/s10854-025-16417-z
  2. Version published to 10.21203/rs.3.rs-7872022/v1 on Research Square